Press Release
3D Semiconductor Packaging Market is Expected to Reach $12 Billion by 2024, Says Variant Market Research
 Published Date:  Jul 2017  Publish By: Variant Market Research

Global 3D Semiconductor Packaging Market Report, published by Variant Market Research, forecast that the global market is expected to reach $12 billion by 2024 from $4 billion in 2016, growing at a CAGR of 15.2% from 2016 to 2024. By geography, Asia-Pacific and Rest of the World (RoW) are expected to grow at a CAGR of 16.2% and 14.8%, respectively, during the forecast period.

"3D Semiconductor Packaging Market (By Technology Type: 3D Package-On-Package, 3D Wire-Bonded, 3D Fan-Out Based, 3D Through-Silicon-Via; By Materials Type: Bonding Wire, Organic Substrate, Encapsulation Resin, Leadframe, Ceramic Package, Die Attach Material; By Industry Vertical: Industrial, Electronics, Healthcare, IT & Telecommunication, Automotive & Transport, Aerospace & Defense; By Geography) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024"

To browse the complete report, visit at: https://www.variantmarketresearch.com/report-categories/semiconductor-electronics/3d-semiconductor-packaging-market

The global 3D semiconductor packaging market is majorly driven by increase in number of portable electronic devices, short replacement period of electronics products, and technological superiorities over 2D packaging technology. However, high initial capital investment would act as a restraint for the market. Growing trend of internet of things would provide several growth opportunities for the market in the coming years.

The global 3D semiconductor packaging market is bifurcated into technology, material type and industry vertical. By technology, the market is further segmented into 3D package-on-package, 3D wire-bonded, 3D through-silicon-via, 3D fan-out based, and others. 3D wire-bonded technology segment accounted for the largest market share in 2016. Material type segment includes bonding wire, encapsulation resin, organic substrate, leadframe, ceramic package, die attach material, and others. By industry vertical, the market is segregated into industrial, electronics, healthcare, IT & telecommunication, automotive & transport, aerospace & defense, and others. Electronics is the predominant segment and accounted for around half of the total market share in 2016, owing to increased adoption of 3D semiconductor packaging in portable electronic devices.

Geographically the market is categorized into North America, Europe, Asia-Pacific, and Rest of the World (RoW). Asia-Pacific accounted for the largest market share in 2016, and it is expected to continue its dominance during the forecast period. The growth is majorly attributed to increasing demand for these chips in China, Taiwan, and Japan. North America accounted for the second largest market share of 23.1%. In terms of growth, Asia-Pacific is expected to grow at the fastest CAGR of 16.2% during the forecast period 2016-2024.

Major players in the 3D semiconductor packaging market include Siliconware Precision Industries Co., Amkor Technology, ASE group, Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Jiangsu Changjiang Electronics Technology Co. Ltd., Qualcomm Technologies, Inc., Intel Corporation, STMicroelectronics, and Taiwan Semiconductor Manufacturing Company, among others.

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Chapter 1 Prefix
    1.1 Market Scope
    1.2 Report Description
    1.3 Research Methodology
          1.3.1 Primary Research
          1.3.2 Secondary Research
          1.3.3 In-house Data Modeling
Chapter 2 Executive Summary
Chapter 3 Market Outline
    3.1 Market Inclination, Trend, Outlook and Viewpoint
    3.2 Market Share Analysis: Company’s Competitive Scenario
    3.3 Value Chain Analysis
    3.4 Market Dynamics
          3.4.1 Drivers
                   3.4.1.1 Impact Analysis
          3.4.2 Restraints
                   3.4.2.1 Impact Analysis
          3.4.3 Opportunities
    3.5 Porter’s five forces analysis
          3.5.1 Factors Impact Analysis
Chapter 4 3D Semiconductor Packaging Market by Technology Type: Market Size and Forecast, 2015 – 2024
    4.1 3D package-on-package
          4.1.1 Current Trend and Analysis
          4.1.2 Market Size and Forecast
    4.2 3D wire-bonded
          4.2.1 Current Trend and Analysis
          4.2.2 Market Size and Forecast
    4.3 3D fan-out based
          4.3.1 Current Trend and Analysis
          4.3.2 Market Size and Forecast
    4.4 3D through-silicon-via
          4.4.1 Current Trend and Analysis
          4.4.2 Market Size and Forecast
    4.5 Others
          4.5.1 Current Trend and Analysis
          4.5.2 Market Size and Forecast
Chapter 5 3D Semiconductor Packaging Market by Materials Type: Market Size and Forecast, 2015 – 2024
    5.1 Bonding wire
          5.1.1 Current Trend and Analysis
          5.1.2 Market Size and Forecast
    5.2 Organic substrate
          5.2.1 Current Trend and Analysis
          5.2.2 Market Size and Forecast
    5.3 Encapsulation resin
          5.3.1 Current Trend and Analysis
          5.3.2 Market Size and Forecast
    5.4 Leadframe
          5.4.1 Current Trend and Analysis
          5.4.2 Market Size and Forecast
    5.5 Ceramic package
          5.5.1 Current Trend and Analysis
          5.5.2 Market Size and Forecast
    5.6 Die attach material
          5.6.1 Current Trend and Analysis
          5.6.2 Market Size and Forecast
    5.7 Other Material Type
          5.7.1 Current Trend and Analysis
          5.7.2 Market Size and Forecast
Chapter 6 3D Semiconductor Packaging Market by Industry Vertical Type: Market Size and Forecast, 2015 – 2024
    6.1 Industrial
          6.1.1 Current Trend and Analysis
          6.1.2 Market Size and Forecast
    6.2 Electronics
          6.2.1 Current Trend and Analysis
          6.2.2 Market Size and Forecast
    6.3 Healthcare
          6.3.1 Current Trend and Analysis
          6.3.2 Market Size and Forecast
    6.4 IT & telecommunication
          6.4.1 Current Trend and Analysis
          6.4.2 Market Size and Forecast
    6.5 Automotive & transport
          6.5.1 Current Trend and Analysis
          6.5.2 Market Size and Forecast
    6.6 Aerospace & defense
          6.6.1 Current Trend and Analysis
          6.6.2 Market Size and Forecast
    6.7 Others
          6.7.1 Current Trend and Analysis
          6.7.2 Market Size and Forecast
Chapter 7 3D Semiconductor Packaging Market by Geography: Market Size and Forecast, 2015 – 2024
    7.1 North America
          7.1.1 Current Trend and Analysis
          7.1.2 Market Size and Forecast
          7.1.3 US
          7.1.4 Canada
          7.1.5 Mexico
    7.2 Europe
          7.2.1 Current Trend and Analysis
          7.2.2 Market Size and Forecast
          7.2.3 Germany
          7.2.4 France
          7.2.5 United Kingdom
          7.2.6 Italy
          7.2.7 Others
    7.3 Asia-Pacific
          7.3.1 Current Trend and Analysis
          7.3.2 Market Size and Forecast
          7.3.3 China
          7.3.4 India
          7.3.5 Japan
          7.3.6 South Korea
          7.3.7 Others
    7.4 RoW
          7.4.1 Current Trend and Analysis
          7.4.2 Market Size and Forecast
          7.4.3 Middle East
          7.4.4 South America
          7.4.5 Africa
Chapter 8 Company Profiles
    8.1 Siliconware Precision Industries Co.
    8.2 Amkor Technology
    8.3 SÜSS MicroTec AG.
    8.4 Intel Corporation
    8.5 Qualcomm Technologies, Inc.,
    8.6 STMicroelectronics
    8.7 ASE group, Ltd.,
    8.8 Jiangsu Changjiang Electronics Technology Co. Ltd.,
    8.9 International Business Machines Corporation (IBM)
    8.10 Taiwan Semiconductor Manufacturing Company

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