Global Flip Chip Technologies MarketReport, published by Variant Market Research, forecast that the global market is expected to reach $54 billion by 2024 from $26.5 billion in 2016; growing at a CAGR of 9.3% from 2016 to 2024. By geography, Asia-Pacific and RoW are expected to grow at a CAGR of 10.2% and 9.9%, respectively, during the forecast period. Flip chip technology is used in several industry verticals like electronics, IT & telecommunication, automotive & transport, industrial, and aerospace & defence, due to its various benefits. Some of its benefits includes reduction in the silicon cost, total package size reduction, high signal density, and decrease in signal inductance.
"Flip Chip Technologies Market (By Bumping Technology: Copper Pillar, Solder Bumping, Gold Bumping, and Other Bumping Technologies; By Packaging Technology: 3D IC, 2.5D IC and 2D IC; By Packaging Type: Flip Chip SiP Package, Flip Chip PGA Package, Flip Chip BGA Package, Flip Chip LGA Package, and Wafer Level Packaging–CSPnl; By industry vertical: Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace and Defence, and Other Industry Verticals; By Geography: North America, Europe, Asia-Pacific and RoW) Global Scenario, Market Size, Outlook, Trend and Forecast, 2015 – 2024"
High demand for miniaturization & high-performing electronic devices to drive the growth ofthe flip chip technologiesmarket
The factors supporting growth of the global flip chip technologies market are improved performance capabilities of flip chip technology, high demand for computing, mobile-wireless, and consumer applications, and high demand for miniaturization & high-performing electronic devices. However, low customization options may act as a restraint for the growth of the market. Moreover, high demand of sensors in electronics devices like smart phones, and personal computerswould provide several growth opportunities for the market in the future years.
Bumping technology, packaging technology, packaging type, industry vertical, and geography are the major segments considered in the global flip chip technologies market. By bumping technology, the market is bifurcated into copper pillar, solder bumping (lead-free solder, and tin-lead eutectic solder), gold bumping & other bumping technologies (aluminium & conductive polymer). Packaging technology includes 3D IC, 2.5D IC and 2D IC. Moreover, the market is further segmented by packaging type as flip chip SiP package, flip chip LGA package, flip chip PGA package, flip chip BGA package, and wafer level packaging–CSPnl. Industry vertical comprises industrial, electronics, automotive & transport, healthcare, IT & telecommunication, aerospace and defence, and other industry verticals (media & entertainment and renewable energy).
The country wise analysis has been also covered under the scope of the report. North America covers the U.S., Canada, and Mexico. Germany, France, Italy, and Rest of Europe are analyzed under the European market. China, Japan, South Korea, Taiwan, India, and Rest of Asia Pacific are included under the Asia-Pacific market. While RoW is bifurcated into South America, Middle East, and Africa.
Copper pillar accounted for the largest market share in the bumping technologysegment
Global Flip Chip Technologies Market,by Bumping Technology
Copper pillaraccounted for the largest market share in 2016, in the bumping technology segment, and are expected to continue its dominance during the forecast period 2016 – 2024, owing to its benefits like high efficiency & compatibility with bond pads, and noticeably low cost than other methods.
2.5D ICaccounted for the largest market share in the packaging technologysegment
Global Flip Chip Technologies Market,by Packaging Technology
2.5D IC accounted for the largest market share in 2016, in the packaging technology segment, and are expected to continue its dominance during the forecast period 2016 – 2024, owing to its several advantages like improved performance, enhanced capacity, and compact system space requirements & low power consumption.
Electronics accounted for the largest market share in the industry vertical segment
Electronics accounted for the largest market share in 2016, in the industry vertical segment, and are expected to continue its dominance during the forecast period 2016 – 2024, owing to high adoption of smartphones & tablets among all the consumer electronic devices.
Asia-Pacificdominated the global market with highest market share over the forecast period
Global Flip Chip Technologies Market Primary Interviews by Geography
Asia-Pacific dominated the global flip chip technologies market with largest market share of 49.32% in 2016, and expected to continue its dominance during the forecasted period, owing to booming market for semiconductors & electronic devices in this region.
The major players operating in the market are ASE group, Samsung Electronics Co., Powertech Technology Inc., Siliconware Precision Industries Co., Ltd., United Microelectronics Corporation, Intel Corporation, Amkor Technology, Inc., TSMC, Jiangsu Changjiang Electronics Technology Co., Ltd., Texas Instruments, Inc., and Amkor Technology, Inc. among others.