Flip Chip Technologies Market Overview :

Global Flip Chip Technologies Market is estimated to reach $54 billion by 2024; growing at a CAGR of 9.3% from 2016 to 2024.Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads. Flip chip is a semiconductor interconnecting device widely used in various electronic products such as PCs, medical devices and smartphones among others. Some of the major benefits of flip chip are increased packaging density, reduced size & thickness, lower cost, and improved performance of the chip, improved thermal capabilities, and improved reliability.

Global Flip Chip Technologies Market Size and Forecast, 2015 - 2024

The global flip chip technologies market is primarily driven by factors such asdeveloping internet of things, superiority of flip chip technology than the traditional wire bond electrical connection, and growing demand for miniaturization &high-performing electronic devices. However, high initial investment required for setting up new manufacturing plant and low availability of customization options may act as a major hindrance for the market growth. Further,growingdemand of sensors in many electronics devices such as personal computers, and smart phones is expected to open up new growth opportunities for the market in the given forecast timeframe.

The flip chip technologies market is segmented into bumping technology,packaging technology, packaging type, industry vertical, and geography. On the basis of bumping technology, the market is segmented into copper pillar, solder bumping (tin-lead eutectic solder, and lead-free solder), gold bumping and other bumping technologies (aluminium & conductive polymer). On the basis of packaging technology, the flip chip technologies market is segmented into 3D IC, 2.5D IC and 2D IC. On the basis of packaging type, the market is segmented into flip chip SiP package, flip chip PGA package, flip chip BGA package, flip chip LGA package, and wafer level packaging–CSPnl. By industry vertical, the market is segmented into electronics, industrial, automotive & transport, healthcare, IT &telecommunication, aerospace and defence, and other industry verticals (renewable energy and media & entertainment).

Global Flip Chip Technologies Market,by Bumping Technology

Based on geography, the global flip chip technologiesmarket is segmented into North America, Europe, Asia-Pacific and RoW. The U.S., Mexico and Canada are covered under North America wherein Europe covers Germany,France, Italy, and Rest of Europe. Asia-Pacific covers China, Japan, South Korea, Taiwan, India, and Rest of Asia Pacific. Rest of the World (RoW) covers South America, Middle East and Africa.

Global Flip Chip Technologies market Regional Revenue %(2016 Vs 2024)

Major players for flip chip technologies market are Samsung Electronics Co., ASE group, Powertech Technology Inc., United Microelectronics Corporation, Intel Corporation, Amkor Technology, Inc.,TSMC,Jiangsu Changjiang Electronics Technology Co., Ltd.,Texas Instruments, Inc., and Siliconware Precision Industries Co., Ltd., among others.

The key takeaways from the report

  • The report will provide detailed analysis of Flip Chip Technologies Market with respect to major segments such as bumping technology,packaging technology, packaging type, and industry vertical
  • The report will include the qualitative and quantitative analysis with market estimation over 2015-2022 and compound annual growth rate (CAGR) between 2016 and 2022.
  • Comprehensive analysis of market dynamics including factors and opportunities.
  • An exhaustive regional analysis of Flip Chip Technologies Market.
  • Profile of key players of the Flip Chip Technologies Market, which include key financials, product & services and new developments.

Scope of Flip Chip Technologies Market

Bumping Technology Segments

  • Copper Pillar
  • Solder Bumping
  • Tin-lead eutectic solder
  • Lead-free solder
  • Gold Bumping
  • OtherBumping Technologies (Aluminium & Conductive polymer)

Packaging Technology Segments

  • 3D IC
  • 2.5D IC
  • 2D IC

Packaging Type Segments

  • Flip Chip SiP Package
  • Flip Chip PGA Package
  • Flip Chip BGA Package
  • Flip Chip LGA Package
  • Wafer Level Packaging–CSPnl

Industry Vertical Segments

  • Electronics
  • Industrial
  • Automotive &Transport
  • Healthcare
  • IT & telecommunication
  • Aerospace and Defence
  • Other Industry Verticals (Renewable Energy and Media & Entertainment)

Geographical Segments

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • India
    • Rest of Asia-Pacific
  • RoW
    • South America
    • Middle East
    • Africa

Global Flip Chip Technologies Market Primary Interviews by Geography


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